@inproceedings{haentjens:hal-01302221, TITLE = {{Packaging tradeoff for high speed device integrations}}, AUTHOR = {Haentjens, Benoit and Desruelles, Guillaume and G{\'e}rald, Chr{\'e}tien and Leborgne, Alain and Haentjens, Yan and Dupuy, Jean-Yves and Felipe, Jorge and Konczykowska, Agnieszka and Beauvisage, Ikram and Delemme, Romain and Martin, Didier and Bila, St{\'e}phane and Frigui, Kamel and Ngoho Moungoho, St{\'e}phane Samuel and Frigui, Bouchra and Mardoyan, Haik}, URL = {https://unilim.hal.science/hal-01302221}, BOOKTITLE = {{International Microelectronics Assembly and Packaging Society }}, ADDRESS = {Orlando, United States}, YEAR = {2015}, HAL_ID = {hal-01302221}, HAL_VERSION = {v1}, }