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Article Dans Une Revue Separation and Purification Technology Année : 2016

Use of a thermal plasma process to recycle silicon kerf loss to solar-grade silicon feedstock

Armelle Vardelle
Gilles Mariaux
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Michel Vardelle
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U. Michon
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V. Beudin
  • Fonction : Auteur

Résumé

The objective of this study was to recycle the dust generated in the slicing of silicon wafers (silicon kerf) by means of a two-stage thermal plasma process. In the first stage, the silicon particles are injected in a plasma jet where silicon oxides and carbon impurities are removed by vaporization. In the second stage, the purified silicon droplets are collected in a silicon bath maintained in a hot-wall crucible. The optimal operating conditions for reduction were determined by injecting into the plasma jet a commercial silicon powder of known degree of oxidation and measuring the attained degree of reduction. Also, silicon powders from wafer slicing were processed in the two-stage plasma set-up. The results of these tests showed that the deoxidation rate of the final silicon ingot was as high as 80% and the initial carbon concentration decreased by 85%. The purification was essentially controlled by the residence time of particles in the hottest zones of the plasma jet and the partial pressure of oxygen in the processing atmosphere.
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Dates et versions

hal-01875458 , version 1 (17-09-2018)

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Citer

M. de Sousa, Armelle Vardelle, Gilles Mariaux, Michel Vardelle, U. Michon, et al.. Use of a thermal plasma process to recycle silicon kerf loss to solar-grade silicon feedstock. Separation and Purification Technology, 2016, 161, pp.187 - 192. ⟨10.1016/j.seppur.2016.02.005⟩. ⟨hal-01875458⟩
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